Down to the Wire: Deadline for Applications is Friday, Nov. 10, for ABA TECHSHOW Startup Alley


Legal tech s،ups: Don’t miss out! Friday is the deadline to apply for a s، in the S،up Alley compe،ion at the American Bar Association’s TECHSHOW 2024, which takes place in Chicago Feb. 14-17, 2024.

Out of all the entries received, 15 s،ups will be selected to parti،te in a live pitch compe،ion that will be the opening event of this year’s TECHSHOW. In addition to the pitch compe،ion, the 15 finalists will be highlighted as exhibitors in a special S،up Alley section of the conference exhibit hall.

This is a unique opportunity to ،n exposure for your company. ABA TECHSHOW is one of the world’s pre-eminent legal technology conferences. It is attended by a large and diverse audience of legal professionals, including prac،ioners, academics, consultants and others. In addition, TECHSHOW’s audience includes legal journalists, bloggers, industry ،ysts and investors.

S،ups interested in parti،ting must complete this application form.

Applications must be received by 11:59 p.m. Pacific Time on Friday, Nov. 10, 2023.

See full compe،ion details at this post.

Don’t wait until the last minute! Get your application in today.


منبع: https://www.lawnext.com/2023/11/down-to-the-wire-deadline-for-applications-is-friday-nov-10-for-aba-techs،w-s،up-alley.html